Electronics
- PCB Inspection
- Laser Trim Inspection
- Fiber Bundle Inspection
- Visual Flow Analysis
- Electronic Component Inspection
- 2D Data Matrix Inspection
- Texwipe Stain Inspection
MVC Industry Overview
Since our inception in 2002, Machine Vision Consulting has been an integral solutions provider in the Semiconductor and Electronics industry. We have worked with leading firms on both R&D and practical machine vision solutions such as PCB inspection, end defects in a fiber bundle, and microscopic flow visualization.
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Laser Trim Inspection
The specific resistance value of a resistor printed onto a ceramic substrate can be trimmed by laser cutting. By visually inspecting the cuts made by a trimming program, the yield and quality of a production line is increased.
Photo Gallery
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Project Video
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System & Vision Requirements
- Ceramic substrates are scanned at 6400 dpi using a customized flatbed scanner.
- Images are 100-200MB in size. Multiple images per part.
- Low contrast and high noise image processing.
- CAD data driven: Gerber part layer data, laser trim job data.
- Asynchronous scanning, inspection, and result analysis.
- Integrated regression analysis.
Vision Technology
- Windows XP, Windows 7, 4GB, multiple core
- Cognex VisionPro & CVL Libraries
- Customized Epson Perfection V750-M Pro Scanner
